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Updated: Jun 17, 2026

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages
Published on: April 13, 2016
Subsurface microscopy of interconnect layers of an integrated circuit
1Department of Electrical and Computer Engineering and the Photonics Center, Boston University, Boston, Massachusetts 02215, USA.
Abstract:
We apply the NA-increasing lens technique to confocal and wide-field backside microscopy of integrated circuits. We demonstrate 325 nm (lambda(0)/4) lateral spatial resolution while imaging metal structures located inside the interconnect layer of an integrated circuit. Vectorial field calculations are presented justifying our findings.
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