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Updated: Jun 16, 2026

Investigation of Early Plasma Evolution Induced by Ultrashort Laser Pulses
Published on: July 2, 2012
Velocity distribution function of sputtered Cu atoms obtained by time resolved optical absorption spectroscopy
Namjun Kang1, Soo-ghee Oh, Freddy Gaboriau
1Université de Toulouse, UPS, INPT, LAPLACE (Laboratoire Plasma et Conversion d'Energie), 118 route de Narbonne, F-31062 Toulouse cedex 9, France.
Researchers developed a novel spectroscopy method to measure sputtered copper atom velocities in plasma discharges. This technique reveals how atom velocity distributions change with distance from the target surface.
Area of Science:
- Plasma Physics
- Materials Science
- Spectroscopy
Background:
- Magnetron plasma discharges are crucial for thin film deposition.
- Understanding sputtered atom behavior is key to controlling film properties.
- Existing methods for measuring sputtered atom velocities have limitations.
Purpose of the Study:
- To introduce a new time-resolved optical absorption spectroscopy method.
- To determine the velocity distribution function of sputtered copper (Cu) atoms.
- To investigate the spatial evolution of these velocity distributions.
Main Methods:
- Utilized time-resolved optical absorption spectroscopy.
- Applied a short 1.5-microsecond pulse.
- Recorded time variations in Cu atom density at 1, 2, and 3 cm from the target.
- Converted density evolution to velocity distributions.
Main Results:
- The method detects sputtered atoms with radial velocities below 0.5 km/s.
- Velocity distributions become more dispersed with increasing distance from the target.
- Average Cu atom velocities range from 2.5-3 km/s near the target.
- At 3 cm and 30 mTorr, average velocities decrease from 2.5 to 1.2 km/s.
Conclusions:
- The proposed spectroscopy method effectively characterizes sputtered atom velocity distributions.
- Spatially resolved velocity data provide insights into plasma-surface interactions.
- The findings contribute to optimizing magnetron sputtering processes for material deposition.
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