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Anodically bonded submicron microfluidic chambers.

S Dimov¹, R G Bennett, A Córcoles

¹Department of Physics, Cornell University, Ithaca, New York 14853, USA.

The Review of Scientific Instruments

|February 2, 2010

Summary

This summary is machine-generated.

Anodic bonding successfully fabricated large, unsupported microcells from glass and silicon. This method enables stable, high-quality microfabrication for various applications.

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Area of Science:

Materials Science
Microfabrication
Surface Engineering

Background:

Microscale devices require precise fabrication techniques.
Traditional methods often necessitate internal support structures, limiting design flexibility.
Anodic bonding is a well-established technique for joining dissimilar materials.

Purpose of the Study:

To demonstrate the fabrication of large-area microcells using anodic bonding.
To achieve microcells with significant dimensions and minimal height without internal supports.
To detail the process parameters and design considerations for successful fabrication.

Main Methods:

Utilized anodic bonding of Hoya SD-2 glass and silicon wafers.
Employed specific temperature (350°C) and voltage (450 V) conditions.
Designed an electrode structure to control the electric field during bonding.
Fabricated cells with dimensions up to 7 x 10 mm² and a height of ~640 nm.
Ensured dimensional stability using 3 mm thick substrates.

Main Results:

Successfully fabricated microcells with characteristic sizes up to 7 x 10 mm².
Achieved a minimal cell height of approximately 640 nm.
Demonstrated fabrication without the need for internal support structures.
Maintained dimensional stability of the fabricated cells under internal pressure.
Detailed the fabrication and characterization procedures.

Conclusions:

Anodic bonding is a viable technique for fabricating large, unsupported microcells.
The developed method offers precise control over cell dimensions and structural integrity.
This fabrication approach has potential applications in microfluidics, sensors, and optical devices.