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Note: Anodic bonding with cooling of heat-sensitive areas
Peter C K Vesborg1, Jakob L Olsen, Toke R Henriksen
1Department of Physics, CINF, Technical University of Denmark (DTU), Building 312, Fysikvej, DK-2800 Kgs. Lyngby, Denmark. peter.vesborg@fysik.dtu.dk
The Review of Scientific Instruments
|February 2, 2010
Summary
This study introduces a novel anodic bonding technique for silicon to borosilicate glass. It enables strong bonds at room temperature by localized cooling, protecting heat-sensitive silicon areas.
Area of Science:
- Materials Science
- Microfabrication
Background:
- Anodic bonding typically requires high temperatures for cation mobility.
- High temperatures can damage heat-sensitive components in microdevices.
Purpose of the Study:
- To develop a low-temperature anodic bonding method for silicon to borosilicate glass.
- To protect heat-sensitive silicon areas during the bonding process.
Main Methods:
- Heating the borosilicate glass from the glass side.
- Simultaneously cooling heat-sensitive silicon areas.
- Utilizing the mobile cations in the heated glass under an electric field.
Main Results:
- Achieved strong anodic bonds between thin silicon samples and borosilicate glass.
- Successfully protected heat-sensitive silicon areas, maintaining near room temperature.
- Demonstrated bonding millimeters away from cooled regions despite silicon's high thermal conductivity.
Conclusions:
- The developed method offers a gentler approach to anodic bonding.
- This technique is suitable for fabricating microdevices with temperature-sensitive components.
- Enables robust silicon-to-glass integration at reduced thermal budgets.
