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Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
Published on: March 20, 2019
Plasma electrochemistry in ionic liquids: deposition of copper nanoparticles
M Brettholle1, O Höfft, L Klarhöfer
1Institute of Particle Technology, Clausthal University of Technology, Robert-Koch-Str, 42, D-38678 Clausthal-Zellerfeld, Germany.
Abstract:
We report on the synthesis of copper nanoparticles in two different water- and air-stable ionic liquids using plasma electrochemical deposition. The copper nanoparticles were deposited in 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl)amide ([Py(1,4)]Tf(2)N) and 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)amide ([EMIm]Tf(2)N). To get information on the dimensions of the particles made, we have applied in situ transmission electron microscopy (TEM) (particles in ionic liquid). The chemical composition was investigated by ex situ X-ray photoelectron spectroscopy (XPS). We found that the copper particles produced in [Py(1,4)]Tf(2)N were larger in size compared to the particles obtained in [EMIm] Tf(2)N (roughly 20 vs. 10 nm). The chemical composition of the particle surface differs too. In both cases the particles are partly oxidised leading to a CuO shell, but the particles obtained in [Py(1,4)]Tf(2)N carry a lot of residues from the ionic liquid.
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