Jove
Visualize
Contact Us

Related Experiment Video

Updated: Jun 14, 2026

Crack Monitoring in Resonance Fatigue Testing of Welded Specimens Using Digital Image Correlation
05:30

Crack Monitoring in Resonance Fatigue Testing of Welded Specimens Using Digital Image Correlation

Published on: September 29, 2019

Detecting nonuniformity in small welds and solder seams using optical correlation and electronic processing.

J W Wagner

    Applied Optics
    |April 8, 2010
    PubMed
    Summary

    This study introduces a holographic method to detect tiny surface changes in microcircuit seams under stress. The technique correlates optical signals with solder adhesion, offering a new way to inspect for flaws in small seams.

    Related Concept Videos

    You might also read

    Related Articles

    Articles linked to this work by shared authors, journal, and citation graph.

    Sort by
    Same author

    Exposure-induced high-pass filtering of a volume by means of an absorption hologram recording technique.

    Applied optics·2010
    Same author

    Variable-cavity-length mode-locked Nd:YAG laser for noncontact generation and spectral control of narrow-band ultrasound.

    Applied optics·2010
    Same author

    Full-field vibrometry using a Fabry-Perot étalon interferometer.

    Applied optics·2010
    Same author

    System for high-speed time-resolved holography of transient events.

    Applied optics·2010
    Same author

    Dual-beam interferometer for the accurate determination of surface-wave velocity.

    Applied optics·2010
    Same author

    Absolute and random error analysis of the dynamic imaging microellipsometry technique.

    Applied optics·2010
    JoVE
    x logofacebook logolinkedin logoyoutube logo
    ABOUT JoVE
    OverviewLeadershipBlogJoVE Help Center
    AUTHORS
    Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
    LIBRARIANS
    TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
    RESEARCH
    JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
    EDUCATION
    JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
    Terms & Conditions of Use
    Privacy Policy
    Policies

    Area of Science:

    • Materials Science
    • Optical Engineering
    • Non-Destructive Testing

    Background:

    • Hermetic microcircuit packages require robust seam integrity for reliability.
    • Current inspection methods for small seams may be limited in sensitivity and scope.
    • Understanding the relationship between seam uniformity and mechanical stress is crucial.

    Purpose of the Study:

    • To develop and validate an optical technique for detecting micro-displacements in microcircuit seams.
    • To correlate optical signal variations with the physical characteristics of solder seams.
    • To assess the potential of this technique for non-destructive inspection of micro-welded and soldered seams.

    Main Methods:

    • Utilized holographic matched filtering for optical analysis.

    More Related Videos

    Automatic Laser-based Geometry Capture for Finite Element Analysis of Weld Beads
    07:58

    Automatic Laser-based Geometry Capture for Finite Element Analysis of Weld Beads

    Published on: July 25, 2025

    Using Digital Image Correlation to Characterize Local Strains on Vascular Tissue Specimens
    09:29

    Using Digital Image Correlation to Characterize Local Strains on Vascular Tissue Specimens

    Published on: January 24, 2016

    Related Experiment Videos

    Last Updated: Jun 14, 2026

    Crack Monitoring in Resonance Fatigue Testing of Welded Specimens Using Digital Image Correlation
    05:30

    Crack Monitoring in Resonance Fatigue Testing of Welded Specimens Using Digital Image Correlation

    Published on: September 29, 2019

    Automatic Laser-based Geometry Capture for Finite Element Analysis of Weld Beads
    07:58

    Automatic Laser-based Geometry Capture for Finite Element Analysis of Weld Beads

    Published on: July 25, 2025

    Using Digital Image Correlation to Characterize Local Strains on Vascular Tissue Specimens
    09:29

    Using Digital Image Correlation to Characterize Local Strains on Vascular Tissue Specimens

    Published on: January 24, 2016

  • Employed electronic processing for signal detection and interpretation.
  • Performed stress application on hermetic microcircuit package seams.
  • Conducted destructive analysis of solder-sealed packages to correlate findings.

    • Main Results:

    • Successfully detected small variations in surface displacement along stressed seams.
    • Established a strong correlation between optical signal changes and nonuniform solder adhesion/wetting.
    • Demonstrated the sensitivity of the holographic technique to seam imperfections.

    Conclusions:

    • Holographic matched filtering with electronic processing is effective for detecting seam flaws.
    • The technique shows promise for non-destructive evaluation of microcircuit seams.
    • This method can identify issues related to solder adhesion and wetting uniformity.