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Compact Lens-less Digital Holographic Microscope for MEMS Inspection and Characterization
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Published on: July 5, 2016

Digital holographic reflectometry.

Tristan Colomb1, Stefan Krivec, Herbert Hutter

  • 1Lyncée Tec SA, PSE-A, CH-1015 Lausanne, Switzerland.

Optics Express
|April 15, 2010
PubMed
Summary
This summary is machine-generated.

Dual-wavelength digital holographic microscopy (DHM) measures micro-structure topography, layer thicknesses, and refractive indices. This advanced DHM reflectometry technique analyzes complex wave propagation through multi-layered specimens.

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Area of Science:

  • Optics and Photonics
  • Materials Science
  • Metrology

Background:

  • Digital holographic microscopy (DHM) typically uses quantitative phase for topography, assuming simple samples.
  • Existing methods are limited for analyzing complex micro-structures with multiple layers.
  • Exploiting only quantitative phase restricts the full potential of DHM for material characterization.

Purpose of the Study:

  • To develop and demonstrate a dual-wavelength DHM reflectometry technique.
  • To simultaneously measure topography, layer thicknesses, and refractive indices of micro-structures.
  • To extend DHM capabilities for analyzing multi-layered specimens.

Main Methods:

  • Interpreting dual-wavelength DHM measurements using a reflected wave propagation model.
  • Applying the model to a three-interfaces specimen (2 layers on a semi-infinite layer).
  • Comparing DHM reflectometry results with profilometer and Secondary Ion Mass Spectrometry (SIMS) data.

Main Results:

  • Simultaneous measurement of topography, layer thicknesses, and refractive indices was achieved.
  • The DHM reflectometry technique accurately characterized SiO(2)/Si targets.
  • Validation was performed on SIMS sputter craters in multi-layered specimens.

Conclusions:

  • Dual-wavelength DHM reflectometry is a powerful tool for micro-structure characterization.
  • This technique overcomes limitations of traditional DHM for complex layered materials.
  • The study demonstrates a significant advancement in non-contact metrology for micro-devices.