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Single-sweep laser writing of 3D-waveguide devices
Matthias Pospiech1, Moritz Emons, Benjamin Väckenstedt
1Institute of Quantum Optics, Leibniz Universität Hannover, Welfengarten 1, D-30167 Hannover, Germany. pospiech@iqo.uni-hannover.de
Optics Express
|April 15, 2010
Summary
Researchers developed a new femtosecond laser writing technique to create multiple 3D waveguides in fused silica. This method allows for dynamic control over waveguide separation and depth, enabling novel photonic device fabrication.
Area of Science:
- Photonics
- Materials Science
- Laser Technology
Background:
- Fused silica is a key material for optical components.
- Precise fabrication of waveguides is crucial for photonic integrated circuits.
- Existing methods for creating multiple waveguides can be limited in flexibility.
Purpose of the Study:
- To present a novel method for simultaneous 3D waveguide fabrication in fused silica.
- To demonstrate dynamic control over waveguide parameters like separation and depth.
- To showcase the application of this technique in creating advanced photonic devices.
Main Methods:
- Utilizing adaptive beam shaping combined with femtosecond laser writing.
- Employing a programmable phase modulator for dynamic phase-pattern variation.
- Adjusting the chirp parameter of a phase grating to control waveguide depth differences.
Main Results:
- Successfully created multiple waveguides simultaneously in 3D fused silica.
- Achieved dynamic control over waveguide separation and depth.
- Demonstrated the fabrication of splitters with outputs at different depths.
Conclusions:
- The developed method offers a flexible approach for fabricating complex waveguide structures.
- This technique has significant potential for various photonic devices, including splitters and couplers.
- Dynamic control over depth variation opens new possibilities in integrated optics design.
