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Determination of the SiO(2)/Si interface roughness by diffuse reflectance measurements
Applied Optics
|June 12, 2010
Summary
This study quantifies silicon dioxide/silicon interface roughness using optical modeling. The method accurately determines surface and interface roughness for thin films, crucial for semiconductor manufacturing.
Area of Science:
- Materials Science
- Optics
- Surface Science
Background:
- Accurate characterization of interfaces is critical in semiconductor fabrication.
- The SiO(2)/Si interface is fundamental to microelectronic devices.
- Quantifying interface roughness impacts device performance and reliability.
Purpose of the Study:
- To develop and validate a model for determining SiO(2)/Si interface roughness.
- To extract quantitative roughness parameters from diffuse reflectance spectra.
- To assess the applicability of Fresnel formalism and scalar scattering theory for interface analysis.
Main Methods:
- Utilized a model based on Fresnel formalism and scalar scattering theory.
- Calculated diffuse reflectance as a function of optical constants, oxide thickness, and interface roughness.
- Employed roughness values as adjustable parameters to fit experimental diffuse reflectance spectra.
Main Results:
- Developed formulas relating diffuse reflectance to interface properties.
- Obtained quantitative interface roughness values for an SiO(2)/Si double layer.
- Achieved excellent agreement between calculated and experimental spectra for a specific CVD film.
Conclusions:
- The model successfully quantifies interface roughness.
- Determined an rms roughness of 9.0 nm at the front surface and 2.2 nm at the SiO(2)/Si interface.
- The approach is effective for characterizing thin dielectric films on silicon substrates.

