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Updated: Jun 11, 2026

Micropunching Lithography for Generating Micro- and Submicron-patterns on Polymer Substrates
Published on: July 2, 2012
Direct e-beam writing of dense and high aspect ratio nanostructures in thick layers of PMMA for electroplating
Sergey Gorelick1, Vitaliy A Guzenko, Joan Vila-Comamala
1Paul Scherrer Institut, CH-5232 Villigen PSI, Switzerland. sergey.gorelick@psi.ch
Abstract:
Due to the ability of 100 keV electrons to penetrate deep into resist with little scattering, we were able to directly write various dense and high aspect ratio nanostructures in 540 nm and 1.1 microm thick layers of poly(methyl methacrylate) (PMMA) resist. The PMMA molds produced by electron beam lithography were developed using a high contrast developer. The molds were used to transfer the pattern into metallic nanostructures by filling the developed trenches with Au by electroplating. By exposing lines narrower than the target width, we observed improved process latitude and line width control. The obtained aspect ratios of the dense structures are nearly 20 in 1.1 microm PMMA layers and > 16 for structures electroplated into this PMMA mold. The fabrication method was successfully applied to produce Au diffractive x-ray Fresnel zone plates of exceptionally good quality with 50 and 70 nm outermost zones using 540 nm and 1.1 microm thick PMMA molds. In addition, we also produced regular arrays of high aspect ratio and dense Au nanorods with periods down to 100 nm and high aspect ratio split-ring resonators.
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