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Updated: Jun 10, 2026

Compact Lens-less Digital Holographic Microscope for MEMS Inspection and Characterization
Published on: July 5, 2016
Measurement of three-dimensional deformations using digital holography with radial sensitivity
Christian Kohler1, Matias R Viotti, G Armando Albertazzi
1LABMETRO: Laboratório de Metrologia e Automatização, Universidade Federal de Santa Catarina, CEP 88040-970, Florianópolis, Santa Catarina, Brazil. chr.kohler@gmail.com
Abstract:
A measurement system based on digital holography for the simultaneous measurement of out-of-plane and radial in-plane displacement fields for the assessment of residual stress is presented. Two holograms are recorded at the same time with a single image taken by a digital camera, allowing the separate evaluation of in-plane and out-of-plane movement. An axis-symmetrical diffractive optical element is used for the illumination of the object, which causes radial sensitivity vectors. By the addition and, respectively, the subtraction, of the four phase maps calculated from two camera frames, the in-plane and out-of-plane deformation of an object can be calculated separately. The device presented is suitable for high-speed, high-resolution measurement of residual stress. In addition to the setup, first measurement results and a short comparison to a mature digital speckle pattern interferometry setup are shown.
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