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Patterning via Optical Saturable Transitions - Fabrication and Characterization
08:19

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Published on: December 11, 2014

Transistors formed from a single lithography step using information encoded in topography.

Michael D Dickey1, Kasey J Russell, Darren J Lipomi

  • 1Department of Chemistry and Chemical Biology, Harvard University, Cambridge, MA 02138, USA.

Small (Weinheim an Der Bergstrasse, Germany)
|August 18, 2010
PubMed
Summary

Topographically encoded microlithography (TEMIL) fabricates electronic components using a single lithography layer and angle-dependent deposition. This method simplifies device production by leveraging 3D resist topography, eliminating registration needs.

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Electrical Engineering

Background:

  • Fabricating complex electronic components often requires multiple lithography and registration steps.
  • Existing shadow evaporation techniques have limitations in complexity and precision.

Purpose of the Study:

  • To introduce a novel fabrication strategy, topographically encoded microlithography (TEMIL), for electronic components.
  • To reduce the number of steps and complexity in fabricating microelectronic devices and arrays.

Main Methods:

  • Combines a single layer of lithography with angle-dependent physical vapor deposition.
  • Utilizes 3D topography of photoresist features and angle-dependent deposition to create patterned material layers.
  • Employs replica molding techniques for creating 3D topography in polymeric resists.

Main Results:

  • Successfully fabricated functional electronic components including transistors, capacitors, resistors, conductors, and logic gates.
  • Eliminated the need for precise registration between sequential deposition steps.
  • Demonstrated the fabrication of complex, interconnected structures from a single patterned resist layer.

Conclusions:

  • TEMIL offers a simplified and versatile approach to microelectronic fabrication.
  • The strategy effectively utilizes 3D topography and angle-dependent deposition for device manufacturing.
  • This method holds potential for fabricating a wide range of microelectronic devices with reduced complexity.