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Optical interconnects using top-surface-emitting microlasers and planar optics.

J Jahns, Y H Lee, C A Burrus

    Applied Optics
    |August 20, 2010
    PubMed
    Summary
    This summary is machine-generated.

    This study explores optical interconnections using microlaser arrays for chip-to-chip communication. A 2x2 laser array demonstrated system viability, considering efficiency, data channels, thermal effects, and integration challenges.

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    Area of Science:

    • Optoelectronics
    • Photonics
    • Computer Engineering

    Background:

    • Chip-to-chip communication faces bandwidth and power limitations with electrical interconnects.
    • Optical interconnections offer a promising solution for high-speed data transfer.
    • Microlaser arrays and free-space optics are key components for advanced optical interconnects.

    Purpose of the Study:

    • To investigate the feasibility of using 2D arrays of top-surface-emitting microlasers with integrated free-space optics for chip-to-chip communication.
    • To analyze critical system parameters for such optical interconnects.

    Main Methods:

    • A demonstration setup utilizing a 2x2 array of microlasers was constructed.
    • System parameters including light efficiency, data channel capacity, thermal effects, power consumption, and hybrid integration were evaluated.

    Main Results:

    • The study presents a functional demonstration of microlaser-based optical interconnections.
    • Key system parameters were analyzed, highlighting areas for optimization.
    • Challenges in hybrid integration of laser chips with passive optics were identified.

    Conclusions:

    • 2D arrays of top-surface-emitting microlasers integrated with free-space optics are a viable technology for chip-to-chip communication.
    • Further research is needed to optimize system parameters and address integration challenges for practical implementation.