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Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
Published on: December 7, 2015
Remarkable reduction of thermal conductivity in silicon nanotubes
Jie Chen1, Gang Zhang, Baowen Li
1Department of Physics and Centre for Computational Science and Engineering, National University of Singapore, Singapore 117546, Singapore.
Abstract:
We propose to reduce the thermal conductivity of silicon nanowires (SiNWs) by introducing a small hole at the center, i.e., construct a silicon nanotube (SiNT) structure. Our numerical results demonstrate that a very small hole (only 1% reduction in cross section area) can induce a 35% reduction in room temperature thermal conductivity. Moreover, with the same cross section area, thermal conductivity of SiNT is only about 33% of that of SiNW at room temperature. The spatial distribution of vibrational energy reveals that localization modes are concentrated on the inner and outer surfaces of SiNTs. The enhanced surface-to-volume ratio in SiNTs reduces the percentage of delocalized modes, which is believed to be responsible for the reduction of thermal conductivity. Our study suggests SiNT is a promising thermoelectric material with low thermal conductivity.

