Optimum placement for optoelectronic multichip modules and the synthesis of diffractive optics for multichip module...

Area of Science:

• Optoelectronics
• Computer-Aided Design
• Nanofabrication

Background:

• Optoelectronic (OE) planar systems require volume reduction for improved performance and integration.
• Current computer-aided design (CAD) methods for OE multichip modules (MCMs) present challenges in minimizing physical footprint.

Purpose of the Study:

• To develop and demonstrate methods for decreasing the system volume of OE planar systems.
• To minimize the maximum interconnect distance within OE MCMs through advanced placement algorithms.
• To present novel hologram designs for implementing interconnect arrays in OE MCMs.

Main Methods:

• Developed placement algorithms tailored to irregular interconnect patterns for OE MCMs.
• Investigated two physical models: transmissive and reflective MCMs.
• Designed and fabricated holographic elements using direct-write electron-beam lithography for near-field reconstruction.

Main Results:

• Demonstrated that minimizing maximum interconnect distance is crucial for OE MCM volume reduction.
• Presented successful simulated and experimental reconstructions of holographic interconnect elements.
• Validated the effectiveness of the developed placement algorithms for twin-butterfly networks.

Conclusions:

• Advanced CAD and novel hologram designs significantly reduce volume in OE planar systems.
• The developed placement algorithms effectively minimize interconnect distances in OE MCMs.
• Holographic elements fabricated by electron-beam lithography are viable for near-field OE interconnects.