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Substrate-facilitated nanoparticle sintering and component interconnection procedure.

Mark Allen¹, Jaakko Leppäniemi, Marja Vilkman

¹VTT Technical Research Centre of Finland, Printed Functional Solutions, Espoo, Finland. mark.allen@vtt.fi

|October 30, 2010

Summary

Room temperature sintering of silver nanoparticles using inkjet printing creates conductive films. This method enables component attachment, offering a new approach for printed electronics and chip-on-demand assembly.

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Area of Science:

Materials Science
Nanotechnology
Electrical Engineering

Background:

Conventional nanoparticle sintering often requires high temperatures, limiting substrate choices and integration possibilities.
Developing low-temperature sintering methods is crucial for flexible electronics and additive manufacturing.

Purpose of the Study:

To demonstrate room temperature substrate-facilitated sintering of silver nanoparticles.
To investigate the mechanism of ligand removal for conductivity enhancement.
To present a novel method for discrete component attachment using printed conductors.

Main Methods:

Utilizing commercially available silver nanoparticle ink and inkjet printing.
Employing a substrate-facilitated chemical process to remove stabilizing ligands.

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Characterizing the electrical conductivity and mechanical properties of the sintered silver films.

Demonstrating the attachment of discrete components to the printed interconnects.

Main Results:

Achieved nanoparticle sintering at room temperature.
Sintered silver films exhibited conductivity exceeding one-fourth that of bulk silver.
Demonstrated robust electrical and mechanical attachment of discrete components.
Validated the potential for printing and chip-on-demand assembly.

Conclusions:

Room temperature sintering of silver nanoparticles is feasible using a substrate-facilitated chemical approach.
This technique offers a viable pathway for creating conductive interconnects for printed electronics.
The demonstrated component attachment method is suitable for on-demand assembly applications.