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Tolerancing of board-level-free-space optical interconnects.

D Zaleta, S Patra, V Ozguz

    Applied Optics
    |November 19, 2010
    PubMed
    Summary
    This summary is machine-generated.

    This study addresses alignment challenges in free-space optical interconnects for electronic packaging. A computer-aided analysis procedure optimizes tolerances, demonstrating feasibility with current technology for improved yield and cost.

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    Area of Science:

    • Optoelectronics and Photonics
    • Optical Engineering
    • Computer-Aided Design

    Background:

    • Optical interconnects require integration with electronic packaging for maturity.
    • Free-space optical interconnects face challenges in alignment and heat dissipation.
    • Assembly and manufacturing variations impact alignment tolerancing over long distances.

    Purpose of the Study:

    • To develop a computer-aided analysis for determining active and passive element tolerances in free-space optical interconnects.
    • To establish a procedure for optimizing system-level specifications like yield and cost.
    • To analyze the impact of various tolerances on optical throughput and system performance.

    Main Methods:

    • Utilizing optical design software (e.g., Code V) to model system design.
    • Performing Gaussian or Fresnel propagation to calculate optical throughput.
    • Employing sensitivity analysis and Monte Carlo techniques for tolerancing analysis.
    • Applying parametric sampling for yield or cost optimization.

    Main Results:

    • A computer-aided analysis procedure was demonstrated for active and passive element tolerancing.
    • Sensitivity analysis identified the relative effects of perturbations on optical throughput.
    • Monte Carlo simulations assessed system yield and cost.
    • A design example showed most tolerances are achievable with current technology.

    Conclusions:

    • The developed computer-aided analysis effectively determines tolerances for free-space optical interconnects.
    • The methodology allows for optimization of system yield and cost.
    • Current manufacturing technology can meet the alignment tolerance requirements for board-level optical interconnects.