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Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
Published on: December 7, 2015
Inkjet printing of multi-walled carbon nanotube/polymer composite thin film for interconnection
Boon Keng Lok1, You Min Ng, Yen Nan Liang
1School of Materials Science and Engineering, Block N4.1 Nanyang Technological University, 639798, Singapore.
Abstract:
In this paper, multi-walled carbon nanotube (MWCNT) ink was selectively patterned by inkjet printing on substrates to form conductive traces and electrodes for interconnection application. MWCNT was firstly functionalized using concentrated acid and dispersed in deionized water to form a colloidal solution. Various concentrations of MWCNT were formulated to test the stability of the solution. The printability of the MWCNT ink was examined against printing temperature, ink concentration and ink droplet pitch. Rheological properties of the ink were determined by rheometer and sessile drop method. The electrical conductivity of the MWCNT pattern was measured against multiple printing of MWCNT on the same pattern (up to 10 layers). While single layer printing pattern exhibited highest resistance, the CNT entangled together and formed a random network with more printed layers has higher conductivity. The electrical properties of the printed film was compared to a composite ink of CNT and conducting polymer (CNT ink was mixed with conductive polymer solution, Poly(3,4-ethylenedioxythiophene)-Poly(styrenesulfonate) (PEDOT:PSS)). Scanning electron microscopy (SEM) was used to observe the surface structure and atomic force microscopy (AFM) was used to study the morphology of the printed film under different conditions.

