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Compact double-layer subwavelength binary blazed grating 1×4 splitter based on silicon-on-insulator.

Junbo Yang1, Zhiping Zhou, Xinjun Wang

  • 1State Key Laboratory on Advanced Optical Communication Systems and Networks, Peking University, Beijing, China.

Optics Letters
|March 16, 2011
PubMed
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This study introduces a compact double-layer waveguide grating splitter for efficient optical coupling and power splitting. The device demonstrates low power differences between output ports, ideal for silicon photonics applications.

Area of Science:

  • Photonics
  • Optical Engineering
  • Materials Science

Background:

  • Efficient coupling between optical fibers and integrated waveguides is crucial for photonic devices.
  • Waveguide grating structures offer a pathway for light manipulation in integrated optics.
  • Silicon-on-insulator (SOI) technology is a leading platform for photonic integrated circuits.

Purpose of the Study:

  • To design and demonstrate a compact double-layer waveguide grating splitter.
  • To achieve efficient coupling between single-mode fiber and SOI optical waveguides.
  • To realize effective power splitting with minimal power difference among output ports.

Main Methods:

  • Optimization of waveguide and grating parameters (thicknesses, periods, height, fill factor).

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  • Utilizing mode matching principles to enhance coupling efficiency.
  • Fabrication tolerance analysis for grating depth variations.

    • Main Results:

    • Achieved efficient coupling between single-mode fiber and SOI waveguides.
    • Demonstrated effective power splitting with a maximum power difference of 6.2% and a minimum of 0.6%.
    • Maintained an average power difference below 10% for TE polarization over a 10 nm bandwidth centered at 1.54 μm.
    • Showcased excellent fabrication tolerance with deviations up to 90 nm in grating depth.

    Conclusions:

    • The developed double-layer waveguide grating splitter offers high performance for optical coupling and splitting.
    • The optimized design minimizes power variations across output ports, enhancing device reliability.
    • The structure's robustness to fabrication variations makes it suitable for practical implementation in photonic integrated circuits.