Updated: Jun 2, 2026

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
Published on: December 23, 2013
1Department of Electrical and Computer Engineering, Michigan Technological University, Houghton, MI 49931, USA. cliao@mtu.edu
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This study introduces a computer-aided design (CAD) method for microfluidic lab-on-a-chip component placement. The novel technique significantly reduces completion time and ensures design constraints are met, even with process variations.
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