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Polyimide surface modification by using microwave plasma for adhesion enhancement of Cu electroless plating
Sang-Jin Cho1, Trieu Nguyen, Jin-Hyo Boo
1Department of Chemistry and Institute of Basic Science, SungKyunKwan University, Suwon 440-746, Republic of Korea.
Journal of Nanoscience and Nanotechnology
|July 21, 2011
Summary
Nitrogen microwave (MW) plasma treatment significantly improves polyimide (PI) surface wettability for enhanced electroless plating adhesion. This surface modification optimizes copper deposition without altering film roughness, crucial for advanced electronic applications.
Area of Science:
- Materials Science
- Surface Chemistry
- Plasma Physics
Background:
- Polyimide (PI) films are widely used in electronics but often require surface modification for improved adhesion.
- Enhancing the adhesion between PI and copper layers is critical for reliable electroless plating in microelectronic fabrication.
- Traditional surface treatments may have limitations in terms of effectiveness or environmental impact.
Purpose of the Study:
- To investigate the effect of nitrogen microwave (MW) plasma treatment on polyimide (PI) surface properties.
- To evaluate the enhancement of adhesion between treated PI surfaces and electroless copper deposition layers.
- To understand the correlation between plasma-induced surface changes and adhesion performance.
Main Methods:
- Nitrogen MW plasma treatment was applied to polyimide (PI) film surfaces.
- X-Ray Photoelectron Spectroscopy (XPS) was used to analyze changes in surface chemical composition.
- Water contact angle measurements assessed surface wettability.
- Atomic Force Microscopy (AFM) characterized surface morphology and roughness.
- Electroless copper deposition was performed using a formaldehyde-free method with PdCl2/SnCl2 activation.
- Tape tests evaluated the adhesion strength between the copper layer and the PI surface.
Main Results:
- Nitrogen MW plasma treatment dramatically decreased the water contact angle of PI films from 72.1 to 16.1 degrees.
- XPS analysis confirmed an increase in nitrogen content on the PI surface after plasma exposure.
- AFM revealed that the root mean square (RMS) roughness of the PI films remained largely unchanged (1.0-1.2) after treatment.
- Successful electroless copper deposition was achieved on the plasma-treated PI surfaces.
- Tape tests indicated significantly improved adhesion between the copper layer and the PI surface.
Conclusions:
- Nitrogen MW plasma treatment is an effective method for enhancing the wettability and adhesion of polyimide surfaces for electroless plating.
- The improved adhesion is attributed to plasma-induced chemical modifications of the PI surface, likely involving nitrogen incorporation.
- The treatment enhances adhesion without significantly altering the surface morphology, preserving the integrity of the PI film.
