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128×128 three-dimensional MEMS optical switch module with simultaneous optical path connection for optical
Masato Mizukami1, Joji Yamaguchi, Naru Nemoto
1NTT Microsystem Integration Laboratories, Nippon Telegraph and Telephone Corporation, 3-1 Morinosato Wakamiya, Atsugi-shi, Kanagawa 243-0198, Japan. mizukami.masato@lab.ntt.co.jp
Applied Optics
|July 21, 2011
Summary
This study introduces a novel 128x128 3D MEMS optical switch module with a control algorithm for stable, high-speed optical connections. The developed prototype demonstrates efficient optical switching suitable for practical optical cross-connect systems.
Area of Science:
- Optoelectronics
- Optical Engineering
- Microelectromechanical Systems (MEMS)
Background:
- Optical cross-connect systems require high-speed, reliable optical switching.
- Existing MEMS optical switches face challenges in simultaneous path switching and power stabilization.
Purpose of the Study:
- To develop and evaluate a 128x128 three-dimensional MEMS optical switch module.
- To implement a switching-control algorithm for high-speed connections and optical power stabilization.
- To assess the module's suitability for practical application in optical cross-connect systems.
Main Methods:
- Design and fabrication of a 128x128 3D MEMS optical switch module.
- Development of a switching-control algorithm for simultaneous optical path switching.
- Experimental validation of insertion loss, switching time, and optical power stabilization.
Main Results:
- The prototype switch module achieved simultaneous switching of all optical paths.
- Insertion loss was measured at less than 4.6 dB (2.3 dB average).
- Switching time was recorded at less than 38 ms (8 ms average), with confirmed optical power stabilization.
Conclusions:
- The developed 128x128 3D MEMS optical switch module meets performance requirements for high-speed optical networks.
- The integrated switching-control algorithm ensures stable optical power, crucial for optical cross-connect systems.
- The module's performance indicates its suitability for practical deployment in telecommunication infrastructure.
