Effect of light-emitting diode photopolymerization modes on the push-out bond strength of a methacrylate-based sealer

The objective of this study was to investigate and compare the effect of different light-emitting diode (LED) polymerization modes on the bond strength of a methacrylate-based sealer used with Resilon or gutta-percha.

Forty extracted single-rooted teeth were sectioned off below the cementoenamel junction, and the root canals were instrumented by using rotary instruments to ISO #30/0.06 taper. The roots were randomly assigned into 1 of the following groups for root canal obturation: (1) RealSeal + Resilon and (2) RealSeal + gutta-percha. In each group, specimens were further subgrouped according to the LED polymerization mode used to cure RealSeal: (1) standard (20 seconds of maximum intensity) and (2) exponential (5 seconds of exponential power increase, followed by 15 seconds of maximum intensity). Specimens were stored in 100% humidity for 1 week at 37 °C. Push-out test was performed at a crosshead speed of 1 mm/min on 2-mm-thick root slices obtained from coronal to apical direction. Multivariate analysis of variance and Tukey tests were used for statistical analysis of the data (P=.05). Failure modes were examined under the scanning electron microscope.

The tested polymerization modes had no significant effect on the bond strength values (P > .05). RealSeal + gutta-percha yielded significantly greater bond strength than RealSeal + Resilon (P < .05). In all groups, the bond strength values decreased significantly from coronal to apical direction (P < .05). Adhesive failure at the sealer-dentin interface was the predominant fracture mode.

The exponential photopolymerization mode had no significant advantage over the standard regimen in terms of dentin bond strength.