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Updated: May 30, 2026

Preparation of Mica and Silicon Substrates for DNA Origami Analysis and Experimentation
Published on: July 23, 2015
Photo-cross-linking-assisted thermal stability of DNA origami structures and its application for higher-temperature
Arivazhagan Rajendran1, Masayuki Endo, Yousuke Katsuda
1Department of Chemistry, Graduate School of Science, Kyoto University, Kitashirakawa-oiwakecho, Sakyo-ku, Kyoto 606-8502, Japan.
Abstract:
Heat tolerance of DNA origami structures has been improved about 30 °C by photo-cross-linking of 8-methoxypsoralen. To demonstrate one of its applications, the cross-linked origami were used for higher-temperature self-assembly, which markedly increased the yield of the assembled product when compared to the self-assembly of non-cross-linked origami at lower-temperature. By contrast, at higher-temperature annealing, native non-cross-linked tiles did not self-assemble to yield the desired product; however, they formed a nonspecific broken structure.

