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Planar and Three-Dimensional Printing of Conductive Inks
Published on: December 9, 2011
Multi-pulsed white light sintering of printed Cu nanoinks
Won-Suk Han1, Jae-Min Hong, Hak-Sung Kim
1Future Convergence Research Division, Korea Institute of Science and Technology, Seoul, Korea.
Nanotechnology
|September 8, 2011
Summary
Optimizing intense pulsed light (IPL) sintering of copper nanoink involves managing pulse energy. Multiple sub-pulses with specific durations and numbers enhance copper film quality and substrate protection.
Area of Science:
- Materials Science
- Nanotechnology
- Photonics
Background:
- Intense pulsed light (IPL) offers rapid, substrate-protective sintering for printable nanoinks.
- Optimizing IPL parameters is crucial for achieving high-quality metal films without defects.
Purpose of the Study:
- To systematically investigate pulse management strategies for maximizing IPL sintering efficiency of printable copper (Cu) nanoink.
- To determine the effects of various pulse formation factors on the electrical properties of sintered Cu films.
Main Methods:
- Studied white light pulse management for intense pulsed light (IPL) sintering.
- Dissipated excessive pulse energy into multiple sub-pulses while maintaining critical total energy.
- Analyzed electrical properties of Cu films in relation to pulse energy, duration, peak power, and number.
Main Results:
- Optimized sintering conditions identified for 30 nm Cu nanoparticles.
- Achieved successful sintering with a total energy of 32 J cm(-2).
- Optimal parameters were a pulse number > 4 and pulse width < 3 msec.
Conclusions:
- Pulse management is key to efficient and defect-free IPL sintering of Cu nanoink.
- Sub-pulse manipulation prevents Cu film defects and substrate damage.
- Established optimal IPL parameters for high-performance sintered copper layers.
