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Updated: Sep 19, 2025

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
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Ultra-Millisecond Flip-Chip Bonding Process via Intense Pulsed Light Irradiation.

Young-Min Ju1, Seong-Ung Ryu1, Jong-Whi Park1

  • 1Department of Mechanical Engineering, Hanyang University, 17 Haengdang-Dong, Seongdong-Gu, Seoul 133-791, South Korea.

ACS Applied Materials & Interfaces
|June 9, 2025
PubMed
Summary
This summary is machine-generated.

Intense pulsed light (IPL) bonding significantly enhances flip-chip ball grid array (FC-BGA) package reliability. This novel process reduces intermetallic compound thickness and improves die shear force by 30% compared to conventional methods.

Keywords:
flip-chip packageintense pulsed lightintermetallic compoundssolder ballultrafast bonding process

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Area of Science:

  • Materials Science
  • Manufacturing Engineering
  • Semiconductor Packaging

Background:

  • Flip-chip ball grid array (FC-BGA) packages are critical in modern electronics.
  • Ensuring the mechanical reliability of solder joints is essential for device longevity.
  • Conventional reflow processes can lead to suboptimal intermetallic compound (IMC) formation and joint strength.

Purpose of the Study:

  • To investigate an intense pulsed light (IPL) flip-chip bonding process for enhanced FC-BGA mechanical reliability.
  • To optimize IPL parameters for reduced bonding time and temperature.
  • To analyze the impact of IPL bonding on solder joint microstructure and mechanical properties.

Main Methods:

  • Utilized in situ temperature and resistance monitoring for real-time bonding data.
  • Developed and validated a numerical thermal transient simulation model.
  • Employed scanning electron microscopy (SEM) to examine solder joint microstructure.
  • Conducted die shear tests to evaluate mechanical reliability.

Main Results:

  • IPL bonding significantly shortened process time from 90s to 56.4ms.
  • Maximum bonding temperature was reduced from 250°C to 221.7°C.
  • Intermetallic compound (IMC) thickness was reduced from 6 μm to approximately 800 nm.
  • Die shear force improved by 30% compared to conventional reflow.

Conclusions:

  • IPL flip-chip bonding offers a highly effective method for improving the mechanical reliability of FC-BGA packages.
  • The optimized IPL process leads to finer IMCs and enhanced solder joint strength.
  • This technology presents a promising alternative for advanced semiconductor packaging manufacturing.