Deformation-pattern-based digital speckle correlation for coefficient of thermal expansion evaluation of film

In this paper, a digital speckle correlation method for coefficient of thermal expansion (CTE) measurement of film is developed, in which CTE is the intrinsic parameter and direct variable. Deformation pattern governed by the CTE and temperature is used to affine transform the image captured after the film is heated. If the values of CTE are properly chosen, the image after affine transformation will have a highest similarity to the original image. This turns CTE measurement into a purely numerical search of an optimal trial CTE. Results of CTEs from this method and conventional DIC methods are compared with the actual CTE, showing an improved accuracy.