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A high-frequency linear ultrasonic array utilizing an interdigitally bonded 2-2 piezo-composite.

Jonathan M Cannata¹, Jay A Williams, Lequan Zhang

¹University of Southern California, Department of Biomedical Engineering, Los Angeles, CA, USA. cannata@usc.edu

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

|October 13, 2011

Summary

This summary is machine-generated.

This study developed a high-frequency ultrasonic array using interdigitally bonded (IB) piezo-composites. The 2-2 IB composite achieved 28 MHz center frequency and 125 µm lateral resolution, outperforming 1-3 composites.

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Area of Science:

Materials Science
Biomedical Engineering
Acoustics

Background:

High-frequency ultrasonic arrays are crucial for advanced medical imaging.
Developing reliable piezo-composite materials is key to achieving high performance.
Interdigitally bonded (IB) composites offer potential for miniaturization and high frequencies.

Purpose of the Study:

To develop a high-frequency 256-element linear ultrasonic array.
To evaluate and select an optimal interdigitally bonded (IB) piezo-composite formulation.
To characterize the performance of the developed ultrasonic array.

Main Methods:

Fabrication and evaluation of various 2-2 and 1-3 IB piezo-composites.
Selection of a fine-grain piezoelectric ceramic for the 2-2 composite.
Manufacturing the array with precise micro-scale features (19-µm pillars, 6-µm kerfs).
Characterization using pulse-echo measurements, directivity, insertion loss, and phantom imaging.

Main Results:

The 2-2 IB composite outperformed 1-3 IB composites, attributed to reduced dicing damage.
Achieved a center frequency of 28 MHz with a 61% -6-dB bandwidth.
Measured -6-dB lateral and axial resolutions of 125 µm and 68 µm, respectively.
Demonstrated a minimum detectable anechoic cyst of approximately 300 µm.

Conclusions:

Fine-scale 2-2 IB piezo-composites are superior for high-frequency linear arrays compared to 1-3 IB composites.
The developed 256-element array offers excellent resolution for high-frequency ultrasound applications.
This work advances the development of next-generation ultrasonic imaging systems.