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Enhanced sputtering from the F/Si(100) surface with extraction of the surface bond direction
N Okabayashi1, K Komaki, Y Yamazaki
1Graduate School of Arts and Sciences, University of Tokyo, Komaba, Meguro, Tokyo 153-8902, Japan. norio@msl.titech.ac.jp
Slow, highly charged ions effectively ionize fluorine atoms on silicon surfaces, releasing fluorine ions. This process, driven by charge transfer, shows a unique symmetry and lower kinetic energy compared to electron-induced desorption.
Area of Science:
- Surface science
- Atomic and molecular physics
- Materials science
Background:
- Understanding ion-surface interactions is crucial for materials modification and analysis.
- Fluorine adsorption on silicon surfaces is relevant for semiconductor processing.
Purpose of the Study:
- Investigate the ionization and desorption of fluorine atoms on a Si(100)-2×1 surface induced by slow, highly charged ions.
- Elucidate the mechanism of fluorine ion (F+) formation and emission.
Main Methods:
- Experimental study using slow, highly charged ion bombardment of a F/Si(100)-2×1 surface.
- Analysis of F+ ion yields and their angular distribution.
- Theoretical modeling based on the classical over barrier model.
Main Results:
- Slow, highly charged ions exhibit a high efficiency for ionizing fluorine atoms.
- F+ ion yields scale with the cube of the incident charge.
- F+ ions are emitted along Si-F bond directions, displaying fourfold symmetry.
- The kinetic energy of highly charged ion-induced F+ ions is lower than that of electron-stimulated F+ ions.
Conclusions:
- Charge transfer from F 2p electrons, explained by an extended classical over barrier model, triggers F+ formation.
- The observed symmetry and yield dependence provide insights into the ion-surface interaction dynamics.
- Highly charged ion-induced desorption offers a distinct pathway for fluorine removal from silicon surfaces.
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