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Updated: May 27, 2026
Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
Published on: June 23, 2017
A novel solution-stamping process for preparation of a highly conductive aluminum thin film
Hye Moon Lee1, Si-Young Choi, Kyung Tae Kim
1Functional Materials Division, Korea Institute of Materials Science, Seongsan-gu, Changwon, Gyeongnam, Korea. hyelee@kims.re.kr
Abstract:
A novel solution-stamping process for the preparation of a highly conductive aluminum thin film on both rigid and flexible substrates is proposed. The superior electrical properties of Al thin films fabricated by the solution-stamping process compared to silver and gold films fabricated from colloidal nanoparticles are experimentally demonstrated, and their applications in electronic circuits on rigid and flexible substrates and to organic light-emitting diodes (OLEDs) are investigated.
