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Bonding temperature optimization and property evolution of SU-8 material in metal/adhesive hybrid wafer bonding

K N Chen1, C A Cheng, W C Huang

  • 1Department of Electronics Engineering, National Chiao Tung University, Hsinchu 300, Taiwan.

Journal of Nanoscience and Nanotechnology
|November 23, 2011
PubMed

Keywords:
SU-8 bondinghybrid wafer bondingthermal decompositionepoxy material

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