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Thermal Scanning Conductometry (TSC) as a General Method for Studying and Controlling the Phase Behavior of Conductive Physical Gels
Published on: January 23, 2018
Verner K Thorsmølle1, Daniel Topgaard, Jan C Brauer
1Institute of Chemical Sciences and Engineering, École Polytechnique Fédérale de Lausanne, Lausanne, Switzerland. verner.thorsmolle@epfl.ch
No abstract available in PubMed .