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Published on: March 13, 2017
Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system
Tom Sterken1, Jan Vanfleteren, Tom Torfs
1Center for Microsystems Technology, IMEC and Ghent University, Gent-Zwijnaarde B-9052, Belgium. Tom.Sterken@UGent.be
Summary
This study introduces a comfortable, wearable wireless ECG monitor using novel Ultra-Thin Chip Package (UTCP) and Stretchable Mould Interconnect (SMI) technologies for enhanced user comfort and miniaturization.
Area of Science:
- Biomedical Engineering
- Wearable Technology
- Electronic Packaging
Background:
- Conventional ECG monitoring devices often lack user comfort due to rigid components.
- Advancements in electronic packaging are crucial for developing unobtrusive wearable health devices.
Purpose of the Study:
- To propose a comfortable and wearable wireless electrocardiogram (ECG) monitoring system.
- To leverage advanced electronic packaging and interconnection technologies for improved device ergonomics.
Main Methods:
- Utilized proprietary Ultra-Thin Chip Package (UTCP) technology for miniaturized components.
- Employed Stretchable Mould Interconnect (SMI) technology to create elastic and stretchable circuits.
- Integrated UTCP and SMI for a fully functional wireless ECG monitoring device.
Main Results:
- Developed a small, fully functional wireless ECG monitoring system.
- Achieved significant improvements in user comfort compared to conventional devices.
- Demonstrated the efficacy of UTCP and SMI in creating comfortable wearable electronics.
Conclusions:
- The proposed system offers a comfortable and wearable solution for wireless ECG monitoring.
- UTCP and SMI technologies are effective in enhancing user comfort and device miniaturization.
- This approach paves the way for more advanced and user-friendly wearable health monitoring systems.
