Related Experiment Video
Updated: May 25, 2026
Characterization of SiN Integrated Optical Phased Arrays on a Wafer-Scale Test Station
Published on: April 1, 2020
First demonstration of high density optical interconnects integrated with lasers, optical modulators, and
Yutaka Urino1, Takanori Shimizu, Makoto Okano
1Institute for Photonics-Electronics Convergence System Technology (PECST), Japan. y-urino@petra-jp.org
Abstract:
Engineers are currently facing some technical issues in support of the exponential performance growths in information industries. One of the most serious issues is a bottleneck of inter-chip interconnects. We propose a new "Photonics-Electronics Convergence System" concept. High density optical interconnects integrated with a 13-channel arrayed laser diode, silicon optical modulators, germanium photodetectors, and silicon optical waveguides on single silicon substrate were demonstrated for the first time using this system. A 5-Gbps error free data transmission and a 3.5-Tbps/cm(2) transmission density were achieved. We believe that this technology will solve the bandwidth bottleneck problem among LSI chips in the future.
