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Emission Spectroscopic Boundary Layer Investigation during Ablative Material Testing in Plasmatron

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Electrical test method using high density plasmas for high-end printed circuit boards.

Se-Jin Oh¹, Young-Cheol Kim, Chin-Wook Chung

¹Department of Electrical Engineering, Hanyang University, Seoul, South Korea. seichan80@naver.com

The Review of Scientific Instruments

|February 4, 2012

Summary

A new plasma-based electrical test method precisely detects open/short failures in high-end printed circuit boards (PCBs). This technique utilizes high-density plasmas to identify even latent defects, improving PCB reliability.

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Area of Science:

Electrical Engineering
Materials Science
Plasma Physics

Background:

High-end printed circuit boards (PCBs) require advanced testing methods to ensure reliability.
Detecting open/short failures, especially latent ones, remains a challenge in PCB manufacturing.

Purpose of the Study:

To propose and validate a novel electrical test method for detecting open/short failures in high-end PCBs.
To leverage high-density plasmas for precise failure analysis.

Main Methods:

A novel electrical test method employing high-density plasmas (inductively coupled discharges) was developed.
The printed circuit board (PCB) is placed in a plasma chamber, with its top side exposed to the plasma sheath.
DC voltage bias and current measurements are performed on the PCB's bottom side via a probe pin.

Main Results:

The method precisely detects open/short failures in high-end PCBs.
Latent open failures can be identified effectively.
Biasing the DC voltage near the plasma potential is crucial for detection due to sheath characteristics.

Conclusions:

The proposed plasma-based electrical test method offers a precise and effective solution for detecting failures in high-end PCBs.
This technique enhances PCB reliability by identifying critical defects, including latent opens.