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Updated: May 25, 2026

14:55
Analysis of Minerals Produced by hFOB 1.19 and Saos-2 Cells Using Transmission Electron Microscopy with Energy Dispersive X-ray Microanalysis
Published on: June 24, 2018
Photoelectron spectromicroscopy at chalcopyrite films
C Pettenkofer1, A Hofmann, W Bremsteller
1E-I1, Helmholtz Zentrum Berlin, 12897 Berlin, Albert-Einsteim Str 15, Germany. pettenkofer@helmholtz-berlin.de
Ultramicroscopy
|February 14, 2012
Summary
Copper indium diselenide (CuInSe₂) films were grown on gallium arsenide (GaAs) substrates. In situ deposition of zinc selenide (ZnSe) and zinc oxide (ZnO) revealed inhomogeneous indium diffusion after annealing, impacting the interface quality.
Area of Science:
- Materials Science
- Surface Science
- Semiconductor Physics
Background:
- Copper indium diselenide (CuInSe₂) is a promising photovoltaic material.
- Understanding interfaces is crucial for optimizing thin-film solar cell performance.
- In situ deposition techniques allow for cleaner interfaces and better control.
Purpose of the Study:
- To investigate the interface properties between CuInSe₂ and subsequently deposited ZnSe/ZnO layers.
- To analyze the lateral homogeneity and diffusion effects at the interface.
- To characterize the impact of annealing on interface morphology and composition.
Main Methods:
- Molecular Beam Epitaxy (MBE) for CuInSe₂ film preparation.
- Metalorganic Molecular Beam Epitaxy (MOMBE) for in situ ZnSe and ZnO deposition.
- X-ray Photoelectron Spectroscopy (XPS), Low Energy Electron Diffraction (LEED), and Spectroscopic X-ray Photoelectron Emission Microscopy (XPEEM) for interface characterization.
Main Results:
- XPS and LEED confirmed the successful deposition of ZnSe and ZnO on CuInSe₂.
- Spectroscopic XPEEM revealed lateral inhomogeneities at the interface.
- In situ annealing induced significant lateral indium diffusion into the ZnSe/ZnO layers.
Conclusions:
- Annealing leads to detrimental In diffusion, affecting the uniformity of the CuInSe₂/ZnSe/ZnO heterostructure.
- Interface quality is compromised by In diffusion, potentially impacting device performance.
- Further strategies are needed to mitigate In diffusion for improved device stability.

