A combination of capillary and dielectrophoresis-driven assembly methods for wafer scale integration of...

The wafer scale integration of carbon nanotubes (CNT) remains a challenge for electronic and electromechanical applications. We propose a novel CNT integration process relying on the combination of controlled capillary assembly and buried electrode dielectrophoresis (DEP). This process enables us to monitor the precise spatial localization of a high density of CNTs and their alignment in a pre-defined direction. Large arrays of independent and low resistivity (4.4 × 10(-5) Ω m) interconnections were achieved using this hybrid assembly with double-walled carbon nanotubes (DWNT). Finally, arrays of suspended individual CNT carpets are realized and we demonstrate their potential use as functional devices by monitoring their resonance frequencies (ranging between 1.7 and 10.5 MHz) using a Fabry-Perot interferometer.