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Comparative analysis of trap-based program/erase behaviors with different tunnel barriers
Dong Hua Li1, Yoon Kim, Doo-Hyun Kim
1Inter-University Semiconductor Research Center (ISRC), School of Electrical Engineering and Computer Science, Seoul National University, 599 Gwanak-ro, Gwanak-gu, Seoul 151-742, Korea.
Journal of Nanoscience and Nanotechnology
|March 14, 2012
Summary
This study enhances Oxide-Nitride-Oxide (ONO) memory devices using a bandgap engineered tunnel dielectric. This innovation significantly boosts memory speed and improves long-term data retention for scaled SONOS flash memory.
Area of Science:
- Materials Science
- Electrical Engineering
- Semiconductor Device Physics
Background:
- Oxide-Nitride-Oxide (ONO) structures are crucial for non-volatile memory devices.
- Optimizing tunnel dielectric properties is key to improving memory performance and reliability.
- Current ONO devices face limitations in speed and data retention.
Purpose of the Study:
- To comparatively analyze trap-based memory characteristics of ONO devices with different tunnel dielectrics.
- To investigate the impact of a bandgap engineered tunnel dielectric on ONO device performance.
- To assess improvements in memory speed and data retention.
Main Methods:
- Fabrication of two types of ONO devices: conventional single tunnel oxide and bandgap engineered structure.
- Characterization of trap-based memory properties.
- Experimental analysis of charge storage and retention.
Main Results:
- The bandgap engineered ONO device demonstrated a 2-4 times promotion in memory speed compared to the conventional device.
- Significant improvements in 10-year data retention were observed in the bandgap engineered device.
- The engineered device exhibits both fast program/erase (P/E) operation speeds and excellent long-term data retention.
Conclusions:
- The bandgap engineered tunnel barrier is a promising approach for performance optimization in scaled SONOS flash memory.
- This engineered structure offers a viable solution for achieving faster operation and enhanced data reliability.
- Future scaled SONOS flash memory can benefit from the integration of bandgap engineered tunnel barriers.

