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Microfluidic Channel-Based Soft Electrodes and Their Application in Capacitive Pressure Sensing
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Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick Photoresists.

Lung-Tai Chen1, Jin-Sheng Chang, Chung-Yi Hsu

  • 1Micro-System Technology Center, Industrial Technology Research Institute. 709 Tainan, Taiwan; E-Mails: rexchen@itri.org.tw (L.T.C.); jimmychang@itri.org.tw (J.S.C.); enoshhsu@itri.org.tw (C.Y.H.).

Sensors (Basel, Switzerland)
|March 29, 2012
PubMed
Summary

Novel plastic packaging for piezoresistive pressure sensors was developed. The sacrifice-replacement approach significantly reduced thermal stress and improved temperature coefficient of span (TCO) performance.

Keywords:
packagingphotoresistpressure sensor

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Area of Science:

  • Materials Science
  • Mechanical Engineering
  • Sensor Technology

Background:

  • Piezoresistive pressure sensors require robust packaging to maintain performance.
  • Packaging-induced stress can significantly impact sensor accuracy and thermal drift.
  • Existing packaging solutions are often bulky and may not meet stringent thermal stability requirements.

Purpose of the Study:

  • To investigate novel, compact plastic packaging for piezoresistive pressure sensors using patterned ultra-thick photoresist.
  • To experimentally and theoretically analyze the performance of two packaging types: sacrifice-replacement and dam-ring.
  • To evaluate the impact of packaging design on thermal signal drift and temperature coefficient of span (TCO).

Main Methods:

  • Utilized finite-element (FE) modeling to simulate packaging-induced stress and thermal effects.
  • Conducted experimental measurements to validate FE model predictions and assess sensor performance.
  • Fabricated and tested two distinct packaging configurations: sacrifice-replacement and dam-ring.

Main Results:

  • The sacrifice-replacement approach with a large sensing-channel opening minimized packaging-induced thermal stress, achieving a low TCO of -0.065% span/°C.
  • The dam-ring approach with a small sensing-channel opening or thin silicon membrane resulted in higher thermal stress and a TCO of -0.19% span/°C.
  • Both packaging methods met the -0.2% span/°C specification, and the proposed packages were significantly smaller (4 × 4 × 1.5 mm³) than commercial alternatives.

Conclusions:

  • The novel plastic packaging, particularly the sacrifice-replacement method, offers a promising solution for enhancing piezoresistive pressure sensor performance.
  • The compact size and improved thermal stability of the proposed packaging are advantageous for miniaturized electronic devices.
  • The developed packaging technology is potentially applicable to other open-cavity sensors, including gas, image, and humidity sensors.