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Updated: May 21, 2026

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
Published on: December 23, 2013
N Bamiedakis1, A Hashim, R V Penty
1Electrical Engineering Division, Department of Engineering, University of Cambridge, 9 JJ Thomson Avenue, Cambridge CB3 0FA, UK. nb301@cam.ac.uk
This study introduces a novel scalable optical regenerative bus architecture using polymer waveguides for high-speed electrical card interconnection. It demonstrates 10 Gb/s data communication with low error rates, enabling flexible bus extension.
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