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Thermal-mechanical-noise-based CMUT characterization and sensing.

Gokce Gurun¹, Michael Hochman, Paul Hasler

¹School of Electrical and Computing Engineering, Georgia Institute of Technology, Atlanta, GA, USA. gurun@gatech.edu

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

|June 22, 2012

Summary

Capacitive micromachined ultrasonic transducers (CMUTs) integrated with low-noise electronics exhibit thermal-mechanical noise. This noise characterizes CMUTs and enables wafer-level testing for manufacturing, even without direct terminal access.

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Thermal Measurement Techniques in Analytical Microfluidic Devices

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Published on: June 3, 2015

Area of Science:

Microelectromechanical Systems (MEMS)
Ultrasonic Transducer Technology
Low-Noise Electronics Integration

Background:

Capacitive micromachined ultrasonic transducers (CMUTs) are susceptible to output noise when integrated with low-noise electronics.
This noise, primarily thermal-mechanical, can dominate system output in both air and immersion, even for low-capacitance devices.
Understanding and characterizing this noise is crucial for reliable CMUT performance.

Purpose of the Study:

To establish a novel method for characterizing CMUTs and integrated electronics using their inherent thermal-mechanical noise.
To demonstrate a technique for testing CMUT array functionality and uniformity during wafer-level manufacturing.
To validate a CMUT model through noise measurements and explore applications in passive sensing.

Main Methods:

Relating CMUT thermal-mechanical noise to electrical admittance for device characterization.
Performing noise measurements on a CMUT-on-CMOS array (800-μm diameter, 10-20 MHz) in air and immersion.
Utilizing finite difference and boundary element methods for CMUT modeling and comparison with experimental data.

Main Results:

Noise measurements in air revealed expected resonance behavior and spring softening effects in the CMUT array.
Immersion noise measurements provided insights into acoustic crosstalk and radiation properties of the CMUT elements.
Excellent agreement between the CMUT model and noise measurements confirmed thermal-mechanical noise dominance.

Conclusions:

The developed noise-based measurement method effectively characterizes CMUTs and integrated electronics, suitable for batch manufacturing.
The approach enables non-invasive testing of CMUT arrays when direct terminal access is unavailable.
This technique can be leveraged for developing CMUT-based passive sensors for environmental or material property measurements.