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Published on: July 2, 2012
Profile estimation for Pt submicron wire on rough Si substrate from experimental data.
Mirza Karamehmedović1, Poul-Erik Hansen, Kai Dirscherl
1Department of Process and Chemical Engineering, University of Bremen, Badgasteiner Str. 3, D-28359 Bremen, Germany. mirza@iwt.uni-bremen.de
Optics Express
|October 6, 2012
Summary
A new scattering model accurately estimates submicron particle profiles on rough surfaces. This method uses discrete sources and surface transfer functions for precise material characterization.
Area of Science:
- Optics and Photonics
- Materials Science
- Computational Physics
Background:
- Accurate characterization of submicron structures on rough surfaces is crucial for nanotechnology.
- Modeling light scattering from particles on substrates presents significant challenges due to surface interactions and roughness.
Purpose of the Study:
- To develop an efficient forward scattering model for penetrable 2D submicron particles on rough substrates.
- To apply this model for the numerical estimation of a platinum (Pt) submicron wire profile on a silicon (Si) substrate.
Main Methods:
- Utilized discrete sources with complex images to model scattering and particle-surface interactions.
- Incorporated a heuristic surface transfer function to describe substrate micro-roughness.
- Employed experimental Bidirectional Reflectance Distribution Function (BRDF) data for model validation.
Main Results:
- Successfully constructed an efficient forward scattering model for submicron particles on rough substrates.
- Demonstrated the model's capability in numerically estimating the profile of a Pt submicron wire.
- Validated the model's accuracy using experimental BRDF data.
Conclusions:
- The developed forward scattering model provides an efficient and accurate method for characterizing submicron structures on rough surfaces.
- This approach has practical implications for material characterization and fabrication in nanotechnology.
- The model's ability to handle particle-surface interactions and substrate roughness is a key advancement.
