Metal-Semiconductor Junctions
Metallic Solids
You might also read
Articles linked to this work by shared authors, journal, and citation graph.
Updated: May 17, 2026

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
Published on: December 7, 2015
Jaime Gallego1, Joël Barrault, Catherine Batiot-Dupeyrat
1Institute of Chemistry, University of Antioquia, A.A. 1226 Medellín, Colombia. jaimegallegomarin@yahoo.es
The intershell spacing of multi-walled carbon nanotubes (MWCNTs) varies with curvature and metal particle interactions. Curvature and specific ring structures expand spacing, while metal interactions compress it.
Area of Science:
Background:
Purpose of the Study:
Main Methods:
Main Results:
Conclusions: