Related Experiment Video
Updated: May 15, 2026
Characterization of SiN Integrated Optical Phased Arrays on a Wafer-Scale Test Station
Published on: April 1, 2020
Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and
Yutaka Urino1, Yoshiji Noguchi, Masataka Noguchi
1Institute for Photonics-Electronics Convergence System Technology, Japan. y-urino@petra-jp.org
Abstract:
One of the most serious issues in information industries is the bandwidth bottleneck in inter-chip interconnects. We propose a photonics-electronics convergence system to solve this issue. We fabricated a high density optical interposer to demonstrate the feasibility of the system by using silicon photonics integrated with an arrayed laser diode, an optical splitter, silicon optical modulators, germanium photodetectors, and silicon optical waveguides on a single silicon substrate. Error-free data transmission at 12.5 Gbps and a transmission density of 6.6 Tbps/cm2 were achieved with the optical interposer. We believe this technology will solve the bandwidth bottleneck problem in the future.
