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Related Concept Videos

Biasing of Metal-Semiconductor Junctions01:27

Biasing of Metal-Semiconductor Junctions

Biasing metal-semiconductor junctions involves applying a voltage across the junction. Specifically, the metal is connected to a voltage source, while the semiconductor is grounded. This technique is essential for controlling the direction and magnitude of current flow in electronic devices, including diodes, transistors, and photovoltaic cells.
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
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Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The semiconductor's...

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Related Experiment Video

Updated: May 15, 2026

Demonstration of Spin-Multiplexed and Direction-Multiplexed All-Dielectric Visible Metaholograms
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An MMI-based polarization splitter using patterned metal and tilted joint.

Keisuke Kojima1, Wangqing Yuan, Bingnan Wang

  • 1Mitsubishi Electric Research Laboratories, 201 Broadway, Cambridge, MA 02139, USA. kojima@merl.com

Optics Express
|December 25, 2012
PubMed
Summary

Researchers developed a compact polarization splitter using an MMI coupler on an InP substrate. This device achieves high extinction ratios and low insertion loss across the C-band, suitable for optical communication systems.

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Published on: February 23, 2017

Area of Science:

  • Photonics and Optical Engineering
  • Materials Science in Optoelectronics

Background:

  • Polarization splitters are crucial components in optical communication systems.
  • Existing devices often face challenges with size, performance, or manufacturing tolerances.

Purpose of the Study:

  • To propose and simulate a novel, compact polarization splitter.
  • To optimize the device for high performance across the C-band and manufacturing robustness.

Main Methods:

  • Utilized a Multi-Mode Interference (MMI) coupler integrated with dielectric and gold layers on an Indium Phosphide (InP) substrate.
  • Employed a tilted joint design to precisely adjust the phase matching of TE and TM modes.
  • Conducted simulations to evaluate device performance parameters.

Main Results:

  • Achieved a polarization extinction ratio exceeding 23 dB for both TE and TM polarizations.
  • Demonstrated an insertion loss below 0.7 dB across the entire C-band wavelength range.
  • The MMI section was designed to be less than 540 μm, ensuring a compact footprint.

Conclusions:

  • The proposed InP-based polarization splitter offers excellent performance metrics.
  • The design demonstrates suitability for broadband applications and tolerance to manufacturing variations.
  • This compact device represents a significant advancement for integrated photonic circuits.