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Chronic Implantation of Multiple Flexible Polymer Electrode Arrays
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Polymeric packaging for fully implantable wireless neural microsensors.

Juan Aceros1, Ming Yin, David A Borton

  • 1School of Engineering, Brown University, Providence, RI 02912, USA. Juan_Aceros@brown.edu

Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference
|February 1, 2013
PubMed
Summary

We developed advanced polymeric packaging for implantable neurosensors, enhancing device longevity and performance. Accelerated testing and a new Hexamethyldisiloxane (HMDSO) coating improve biocompatibility and reliability for in-vivo applications.

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Area of Science:

  • Biomedical Engineering
  • Materials Science
  • Neuroscience

Background:

  • Subcutaneous, fully implantable neurosensors require robust, biocompatible packaging.
  • Current polydimethylsiloxane (PDMS) encapsulation has limitations for long-term in-vivo use.
  • Accelerated testing is crucial for characterizing new packaging materials and processes.

Purpose of the Study:

  • To present novel polymeric packaging methods for implantable neurosensors.
  • To introduce an accelerated testing tool for biocompatible packaging materials.
  • To develop and evaluate an augmenting polymer thin film for enhanced encapsulation.

Main Methods:

  • Development of specialized test units for simulating implantable neurosensor components.
  • In-vivo testing of encapsulated neurosensors in swine and non-human primates.
  • Application of a novel thin film coating using Plasma Enhanced Chemical Vapor Deposition (PECVD) of Hexamethyldisiloxane (HMDSO) and Oxygen (O2).

Main Results:

  • Successful in-vivo implantation and testing of multiple neurosensors.
  • Demonstration of an effective accelerated testing and characterization tool.
  • Introduction of a new HMDSO/O2 PECVD thin film as a complementary encapsulation layer to PDMS.

Conclusions:

  • The developed polymeric packaging methods and accelerated testing tools are effective for implantable neurosensors.
  • The novel HMDSO/O2 PECVD thin film shows promise for augmenting PDMS encapsulation.
  • These advancements contribute to the development of more reliable and long-lasting implantable neuroelectronic devices.