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Updated: May 12, 2026

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Application of a Coupling Agent to Improve the Dielectric Properties of Polymer-Based Nanocomposites
Published on: September 19, 2020
Clay-based nanocomposite coating for flexible optoelectronics applying commercial polymers.
Daniel A Kunz1, Jasmin Schmid, Patrick Feicht
1Department of Inorganic Chemistry I, University of Bayreuth, Universitätsstraße 30, 95440 Bayreuth, Germany.
ACS Nano
|April 3, 2013
Summary
This study introduces a thin, flexible nanocomposite coating for packaging organic electronics. The coating offers exceptional barrier properties against oxygen and water vapor, crucial for device longevity.
Area of Science:
- Materials Science
- Nanotechnology
- Polymer Science
Background:
- Packaging for flexible organic electronics requires high transparency, flexibility, and low oxygen (OTR) and water vapor (WVTR) transmission rates.
- Achieving simultaneous optimization of these properties presents a significant challenge in materials development.
Purpose of the Study:
- To develop a novel nanocomposite coating with superior barrier properties and high transparency for flexible electronic encapsulation.
- To demonstrate a scalable and benign manufacturing process for the functional films.
Main Methods:
- A thin (1.5 μm) nanocomposite coating was fabricated using a commercially available polyurethane matrix (Desmodur N 3600 and Desmophen 670 BA).
- Delaminated synthetic layered silicates with high aspect ratios were incorporated into the polyurethane matrix.
- Functional films were prepared via doctor-blading of a suspension containing the matrix and organophilized clay.
Main Results:
- The resulting nanocomposite coating exhibits excellent transparency and flexibility.
- Exceptionally low OTR (1.0 × 10(-2) cm(3) m(-2) day(-1) bar(-1)) and WVTR (<0.05 g m(-2) day(-1) at 50% RH) were achieved.
- The doctor-blading preparation method is scalable and technically benign.
Conclusions:
- The developed nanocomposite coating effectively addresses key packaging challenges for flexible organic electronics.
- The material and fabrication method show significant promise for the encapsulation of sensitive flexible electronic devices.
- This advancement contributes to the commercial viability of flexible organic photovoltaics and organic light-emitting diodes.

