Nanosize-controlled titanium nitride films in pulsed dc magnetron sputtering

Area of Science:

• Materials Science
• Surface Engineering
• Thin Film Technology

Background:

• Titanium nitride (TiN) films are widely used for their hardness and wear resistance.
• Optimizing deposition methods is crucial for enhancing TiN film properties.

Purpose of the Study:

• To investigate the impact of direct current (dc) and pulsed dc magnetron sputtering on titanium nitride (TiN) film characteristics.
• To analyze the effect of target frequencies (0-50 kHz) on nano-grain size, microstructure, and surface roughness of TiN films.

Main Methods:

• Deposition of TiN films using dc and pulsed dc magnetron sputtering at varying target frequencies.
• Analysis of crystal grain size, microstructure (surface and cross-section), and surface roughness using grazing incidence X-ray diffraction (GIXRD), field-emission scanning electron microscopy (FESEM), and atomic force microscopy (AFM).

Main Results:

• Pulsed dc sputtered TiN films exhibited higher hardness and Young's modulus, with smaller grain size and lower surface roughness compared to dc sputtered films.
• Increasing target frequency significantly improved film properties, resulting in nano-grain size, dense microstructure, and smooth surfaces.
• High target frequencies led to superhard TiN films due to enhanced ion energy and flux from pulsed plasma.

Conclusions:

• Pulsed dc magnetron sputtering is a superior method for producing high-performance TiN films.
• Target frequency is a critical parameter for controlling TiN film microstructure and mechanical properties.
• Optimized pulsed dc sputtering at high frequencies yields advanced TiN coatings with exceptional hardness and surface characteristics.