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Depletion-mode carrier-plasma optical modulator in zero-change advanced CMOS
Jeffrey M Shainline1, Jason S Orcutt, Mark T Wade
1Department of Electrical, Computer and Energy Engineering, University of Colorado, Boulder, Colorado 80309, USA. jeffrey.shainline@osamember.org
Optics Letters
|August 2, 2013
Summary
We developed a novel optical modulator using standard silicon chip manufacturing. This breakthrough enables high-speed, low-energy data modulation for advanced electronics and computer processors.
Area of Science:
- Photonics
- Semiconductor device physics
- Integrated circuits
Background:
- Advanced electronics require efficient optical modulators for high-speed data transmission.
- Integrating optical devices with standard microprocessors remains a challenge due to process incompatibilities.
Purpose of the Study:
- To demonstrate a depletion-mode carrier-plasma optical modulator fabricated using a standard 45 nm node silicon complementary metal-oxide-semiconductor (CMOS) process without modifications.
- To enable monolithic integration of optical modulators with state-of-the-art microprocessors and electronics.
Main Methods:
- A novel resonant modulator design utilizing a hybrid microring/disk cavity within the silicon transistor body layer.
- Fabrication in a standard 45 nm node SOI CMOS process, accommodating lateral p-n junctions instead of ridge waveguides.
- Electrical contact via silicon spokes connecting to p and n regions formed by transistor well implants for index modulation.
Main Results:
- Achieved 5 Gbps data modulation at 1265 nm wavelength with a 5.2 dB extinction ratio.
- Demonstrated low energy consumption of an estimated 40 fJ/bit.
- Exhibited broad thermal tuning across 3.2 THz (18 nm) with an efficiency of 291 GHz/mW.
Conclusions:
- The developed modulator is the first of its kind fabricated in a standard CMOS process, enabling zero-change CMOS photonics.
- This technology is crucial for advancing monolithically integrated CMOS photonic interconnects for future electronics.
- The device's performance metrics and fabrication compatibility represent a significant step towards widespread adoption.
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