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Updated: May 7, 2026

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
Published on: December 23, 2013
Elisabeth Wilhelm1, Christiane Neumann, Thomas Duttenhofer
1Karlsruhe Institute of Technology (KIT), Institute of Microstructure Technology (IMT), Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany. bastian.rapp@kit.edu.
A new reusable Chip-to-World-Interface (CWI) enables contamination-free connections for microfluidic chips. This chemically inert interface supports high flow rates and diverse solvents, advancing microfluidic applications.
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